RoHS指令信息： 1888101-1 Statement of Compliance
RoHS 2 Statement

3D 型號： 1888101-1.pdf

標準包裝：256
系列：-
包裝：托盤
連接器樣式：機架
連接器類型：XFP
針腳數：-
安裝類型：通孔，直角
端接：壓配式
特性：EMI 屏蔽
觸頭鍍層：-
觸頭鍍層厚度：-
配用：A97465DKR-ND - CONN XFP 30POS HI-SPEED 30AU SMD
A97464DKR-ND - CONN XFP 30POS 30GOLD SMD
A97460DKR-ND - CONN XFP 30POS 15GOLD SMD
A97465CT-ND - CONN XFP 30POS HI-SPEED 30AU SMD
A97464CT-ND - CONN XFP 30POS 30GOLD SMD
A97460CT-ND - CONN XFP 30POS 15GOLD SMD
A97465TR-ND - CONN XFP 30POS HI-SPEED 30AU SMD
A97464TR-ND - CONN XFP 30POS 30GOLD SMD
A97460TR-ND - CONN XFP 30POS 15GOLD SMD

相關產品：A97542-ND - DUST CAP FOR XFP AND QSFP
A97467-ND - HEAT SINK XFP NETWORK APPS
A97466-ND - HEAT SINK XFP PCI APPLICATIONS
A97463-ND - HEAT SINK XFP SAN APPLICATIONS